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LTC2855IGN#PBF - Analog Devices

Description: Linear Technology LTC2855IGN#PBF, Multiprotocol Transceiver, 1 (RS-485/RS-422)-TX 1 (RS-485/RS-422)-RX

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LTC2855IGN#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC2855IGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Plastic SSOP
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LTC2855IGN#PBF - Analog Devices - 3D model - Small Outline Packages - 16-Lead Plastic SSOP
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LTC2855IGN#PBF Details

  • Manufacturer Part Number:

    LTC2855IGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485-A; TIA-485-A

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.8895 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    70 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    50 ns

  • Width:

    3.899 mm

LTC2855IGN#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2855IGN#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and ensure optimal performance.
  • The LTC2855IGN#PBF requires a single 3.3V or 5V power supply. It's recommended to use a low-noise, low-dropout regulator (LDO) to power the device. The power sequencing requirements involve powering up the device in the following order: VCC, then VDD, and finally the digital inputs. It's also recommended to add decoupling capacitors close to the power pins to filter out noise.
  • The LTC2855IGN#PBF can achieve a maximum data transfer rate of up to 100 Mbps, making it suitable for high-speed applications such as industrial automation, medical devices, and automotive systems.
  • The LTC2855IGN#PBF is a flexible device that can be configured for different communication protocols using the MODE pin. For SPI mode, tie the MODE pin to VCC. For I2C mode, tie the MODE pin to GND. For UART mode, tie the MODE pin to VCC through a 1kΩ resistor. Additionally, the device requires external resistors and capacitors to configure the transmission line.
  • The LTC2855IGN#PBF has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device temperature below 125°C. Thermal management considerations include using a heat sink, ensuring good airflow, and minimizing power dissipation. It's also recommended to use thermal interface materials to improve heat transfer between the device and the heat sink.

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LTC2855IGN#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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