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LTC4099EUDC#PBF - Analog Devices

Description: IC USB PWR MANAGER/CHRGR 20-QFN

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LTC4099EUDC#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UDC (3mmX4mm)_1
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LTC4099EUDC#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UDC (3mmX4mm)_1
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LTC4099EUDC#PBF Details

  • Manufacturer Part Number:

    LTC4099EUDC#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1742

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INPUT FAULT PROTECTION CONTROLLER

  • JESD-30 Code:

    R-PQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.35 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC4099EUDC#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4099EUDC involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure the LTC4099EUDC operates within its SOA, monitor the input voltage, output voltage, and output current. Make sure the input voltage does not exceed 18V, the output voltage does not exceed 15V, and the output current does not exceed 2A. Also, ensure the device temperature does not exceed 125°C.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. This value provides a good balance between input ripple rejection and stability. The capacitor should be placed as close to the VIN pin as possible.
  • The LTC4099EUDC is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. If operation above 85°C is required, consider using a heat sink or a thermally-enhanced package. Always check the device's thermal performance and reliability in your specific application.
  • To troubleshoot issues with the LTC4099EUDC, start by checking the input voltage, output voltage, and output current. Verify that the input voltage is within the recommended range and that the output voltage is within the desired range. Check for any signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for output voltage ripple or oscillations. Consult the datasheet and application notes for guidance on troubleshooting specific issues.

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LTC4099EUDC#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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