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MAX11632EEG+ - Analog Devices

Description: 12-Bit, 300ksps ADCs with FIFO and Internal Reference

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MAX11632EEG+ Details

  • Manufacturer Part Number:

    MAX11632EEG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-QSOP-150_MIL

  • Package Description:

    ROHS COMPLIANT, QSOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2010-07-27

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    4.168 V

  • Conversion Time-Max:

    3.33 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    16

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP24,.24

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    0.3 MHz

  • Sample and Hold / Track and Hold:

    TRACK

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX11632EEG+ Frequently Asked Questions (FAQs)

  • The recommended layout and routing for the MAX11632EEG+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the analog input traces. Additionally, it's recommended to place the device close to the analog signal sources and to use a low-impedance power supply.
  • To optimize the performance of the MAX11632EEG+ in noisy environments, it's recommended to use a low-pass filter on the analog input, use a shielded cable for the analog input, and to place the device in a shielded enclosure. Additionally, using a common-mode choke on the power supply lines can help to reduce noise.
  • The maximum sampling rate that can be achieved with the MAX11632EEG+ is 1.5Msps (megasamples per second). However, the actual sampling rate may be limited by the system's clock frequency, the analog input bandwidth, and the digital interface used.
  • The MAX11632EEG+ does not require calibration. However, it's recommended to perform a system-level calibration to ensure that the overall system is functioning correctly. This may involve adjusting the gain and offset of the analog input signal, as well as verifying the accuracy of the digital output.
  • The power consumption of the MAX11632EEG+ depends on the operating mode and the clock frequency. In normal operation, the device consumes around 15mA from a 3.3V power supply. In shutdown mode, the power consumption is reduced to around 1μA.

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MAX11632EEG+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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