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MAX132CNG+ - Analog Devices

Description: ADC,+/-18 bit,Serial,SDIP24,MAX132CNG+ MAX132CNG+, 18 bit ADC Differential, Serial, 24-Pin PDIP

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MAX132CNG+ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 24 PDIP 300mil
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MAX132CNG+ - Analog Devices  - 3D model - Dual-In-Line Packages - 24 PDIP 300mil
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MAX132CNG+ Details

  • Manufacturer Part Number:

    MAX132CNG+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-PDIP-300_MIL

  • Package Description:

    PLASTIC, DIP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-PDIP-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    1999-05-25

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog Input Voltage-Max:

    6 V

  • Analog Input Voltage-Min:

    -9 V

  • Converter Type:

    ADC, MULTI-SLOPE

  • JESD-30 Code:

    R-PDIP-T24

  • JESD-609 Code:

    e3

  • Length:

    31.75 mm

  • Linearity Error-Max (EL):

    0.006%

  • Moisture Sensitivity Level:

    1

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Analog In Channels:

    1

  • Number of Bits:

    18

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    0.125 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    15.24 mm

MAX132CNG+ Frequently Asked Questions (FAQs)

  • A good layout and routing practice for the MAX132CNG+ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the input traces. Additionally, it's recommended to place the device close to the signal source and use a low-impedance path for the output. A 4-layer PCB with a dedicated analog ground layer is also recommended.
  • To ensure proper biasing and configuration, refer to the datasheet for the recommended voltage supply and biasing resistors. Additionally, consider the input signal range and adjust the gain and offset accordingly. It's also important to consider the output load impedance and adjust the output stage accordingly. If unsure, consult with an experienced analog design engineer or contact Analog Devices' technical support.
  • Common pitfalls to avoid when designing with the MAX132CNG+ include not following proper PCB layout and routing guidelines, not providing adequate power supply decoupling, and not considering the input signal range and output load impedance. Additionally, not accounting for thermal considerations and not providing adequate heat sinking can also lead to reduced performance or device failure.
  • To troubleshoot issues with the MAX132CNG+, start by verifying the power supply voltage and ensuring that it's within the recommended range. Next, check the input signal range and ensure it's within the device's specified range. Use an oscilloscope to verify the output signal and check for any signs of distortion or clipping. If the issue persists, consult the datasheet and application notes, or contact Analog Devices' technical support for further assistance.
  • The MAX132CNG+ has a maximum junction temperature of 150°C. To ensure proper heat sinking, use a heat sink with a thermal resistance of less than 10°C/W and ensure good thermal contact between the device and the heat sink. Additionally, consider the PCB layout and ensure that there is adequate clearance around the device to allow for airflow. Consult the datasheet and application notes for more detailed thermal design guidelines.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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