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MAX3097ECEE+ - Analog Devices

Description: Maxim MAX3097ECEE+, 3-RX Triple Line Receiver, RS-422/ RS-485, 3 → 5.5 V, 16-Pin QSOP

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MAX3097ECEE+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MAX 21-0055_B
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MAX3097ECEE+ - Analog Devices  - 3D model - Small Outline Packages - MAX 21-0055_B
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MAX3097ECEE+ Details

  • Manufacturer Part Number:

    MAX3097ECEE+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-QSOP-150_MIL

  • Package Description:

    0.150 INCH, 0.025 INCH PITCH, QSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-QSOP-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2000-08-10

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    85 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.73 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MAX3097ECEE+ Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3097ECEE+ involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure reliable operation of the MAX3097ECEE+ in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources.
  • The maximum cable length that can be driven by the MAX3097ECEE+ depends on the cable characteristics, signal frequency, and desired signal integrity. As a general rule, the MAX3097ECEE+ can drive cables up to 100 meters long at data rates up to 100 Mbps.
  • To troubleshoot issues with the MAX3097ECEE+, start by checking the power supply voltage, signal integrity, and PCB layout. Use an oscilloscope to verify the signal waveforms and check for noise or distortion. Also, consult the datasheet and application notes for troubleshooting guidelines.
  • Yes, the MAX3097ECEE+ can be used in redundant or fault-tolerant systems. The device's built-in fault detection and reporting features make it suitable for use in high-reliability applications. However, additional external circuitry may be required to implement redundancy or fault tolerance.

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MAX3097ECEE+ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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