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MAX3295AUT/V+T - Analog Devices

Description: RS-422/RS-485 Interface IC 20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters U6CN+2

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MAX3295AUT/V+T - Analog Devices PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - U6SN +1
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MAX3295AUT/V+T - Analog Devices  - 3D model - SOT23 (6-Pin) - U6SN +1
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MAX3295AUT/V+T Details

  • Manufacturer Part Number:

    MAX3295AUT/V+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    6-SOT_23-N/A

  • Package Description:

    SOT-23, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    6-SOT_23-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2003-02-25

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    70 ns

  • Width:

    1.625 mm

MAX3295AUT/V+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX3295AUT/V+T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to keep the input traces as short as possible.
  • To ensure proper power-up and initialization, it's recommended to follow a specific power-up sequence: first, apply VCC, then apply VDD, and finally, apply the input signals. Additionally, make sure to meet the recommended power-up ramp time and voltage requirements.
  • The MAX3295AUT/V+T has an operating temperature range of -40°C to +125°C. However, it's recommended to operate the device within a temperature range of -20°C to +85°C for optimal performance and reliability.
  • To troubleshoot common issues with the MAX3295AUT/V+T, start by checking the power supply voltage, input signal integrity, and PCB layout. Use an oscilloscope to measure the output voltage and input signals, and check for any signs of oscillation or noise. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Yes, the MAX3295AUT/V+T is suitable for high-reliability and safety-critical applications. However, it's essential to follow proper design and testing procedures, including fault injection testing, to ensure the device meets the required safety and reliability standards.

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MAX3295AUT/V+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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