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MAX5976AETE+T - Analog Devices

Description: 2.7V to 18V, 7A, Hot-Swap Solution

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MAX5976AETE+T - Analog Devices - PCB symbol
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PCB Footprints
MAX5976AETE+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - T1655+3
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MAX5976AETE+T - Analog Devices - 3D model - Quad Flat No-Lead - T1655+3
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MAX5976AETE+T Details

  • Manufacturer Part Number:

    MAX5976AETE+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-LFCSP-5X5X0.75

  • Package Description:

    5 X 5 MM, ROHS COMPLIANT, TQFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-LFCSP-5X5X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2010-10-15

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    HOT SWAP CONTROLLER

  • JESD-30 Code:

    S-XQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    12 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

MAX5976AETE+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX5976AETE+T involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB under the device, and to use a heat sink or thermal interface material (TIM) to dissipate heat. The device's thermal pad should be connected to a solid ground plane to help dissipate heat. Additionally, keeping the device away from other heat sources and using a well-ventilated enclosure can also help.
  • The recommended input capacitor value for the MAX5976AETE+T is 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended due to its low equivalent series resistance (ESR) and high ripple current capability.
  • To troubleshoot issues with the MAX5976AETE+T, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is properly connected and that the input and output capacitors are of the correct value and type. Check for signs of overheating, such as excessive temperature or thermal shutdown. Use an oscilloscope to check for noise or oscillations on the input or output. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the MAX5976AETE+T is qualified for use in high-reliability and high-temperature applications. It is available in a variety of grades, including the industrial temperature range (-40°C to +85°C) and the automotive temperature range (-40°C to +125°C). However, it's recommended to consult the datasheet and application notes for specific guidance on using the device in high-reliability or high-temperature applications.

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MAX5976AETE+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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