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MAX77278EWB+T - Analog Devices

Description: 2.7V ~ 5.5V, Ultra-Low Power PMIC with 3-Output SIMO, Power Path Charger Optimized for Small Li+, 425mA 35-WLP (3.15x2.15)

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MAX77278EWB+T - Analog Devices - PCB symbol
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PCB Footprints
MAX77278EWB+T - Analog Devices PCB footprint - BGA - BGA - 35 WLP (3.15mm x 2.15mm x 0.7mm, 0.4mm PITCH)
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MAX77278EWB+T - Analog Devices - 3D model - BGA - 35 WLP (3.15mm x 2.15mm x 0.7mm, 0.4mm PITCH)
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MAX77278EWB+T Details

  • Manufacturer Part Number:

    MAX77278EWB+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    35-WLCSP-N/A

  • Package Description:

    WLP-35

  • Pin Count:

    35

  • Manufacturer Package Code:

    35-WLCSP-N/A

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-08-17

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    R-PBGA-B35

  • Length:

    3.148 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    35

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA35,5X7,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.69 mm

  • Supply Voltage-Nom (Vsup):

    4.2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Threshold Voltage-Nom:

    +2.6V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2.148 mm

MAX77278EWB+T Frequently Asked Questions (FAQs)

  • A good PCB layout for the MAX77278EWB+T involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 1uF to 10uF, while the output capacitor should be a low-ESR ceramic or tantalum capacitor with a value between 1uF to 22uF. The capacitor values and types should be chosen based on the specific application requirements and operating conditions.
  • The MAX77278EWB+T has an operating ambient temperature range of -40°C to +125°C, but the maximum junction temperature should not exceed 150°C. The device should be derated for temperatures above 85°C to ensure reliable operation.
  • The MAX77278EWB+T should be powered up and powered down slowly to prevent voltage spikes and overshoots. A soft-start circuit can be used to control the power-up sequence, and a voltage supervisor can be used to monitor the input voltage and ensure a clean power-down sequence.
  • The recommended input voltage range for the MAX77278EWB+T is 2.7V to 5.5V, but the device can operate with input voltages as low as 2.5V and as high as 6V. However, the output voltage and current capabilities may be reduced at lower input voltages.

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MAX77278EWB+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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