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MAX9860ETG+T - Analog Devices

Description: MAXIM INTEGRATED PRODUCTS - MAX9860ETG+T - AUDIO CODEC, 48KSPS, I2C/I2S, TQFN-24

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MAX9860ETG+T - Analog Devices - PCB symbol
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PCB Footprints
MAX9860ETG+T - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - TQFN-24 (T2444-4)
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3D Models
MAX9860ETG+T - Analog Devices - 3D model - Quad Flat No-Lead - TQFN-24 (T2444-4)
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MAX9860ETG+T Details

  • Manufacturer Part Number:

    MAX9860ETG+T

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    24-LFCSP-4X4X0.75

  • Package Description:

    4 X 4 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, QFN-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    24-LFCSP-4X4X0.75

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2008-11-14

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-XQCC-N24

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC24(UNSPEC)

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

MAX9860ETG+T Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the MAX9860ETG+T can be found in the 'Layout Considerations' section of the datasheet. Additionally, Analog Devices provides a layout guide and a reference design that can be used as a starting point for PCB design.
  • To optimize the performance of the MAX9860ETG+T, it's recommended to follow the application notes and design guidelines provided by Analog Devices. Additionally, engineers can use simulation tools such as SPICE models to simulate the device's behavior and optimize the design. It's also recommended to consult with Analog Devices' technical support team for specific guidance.
  • The MAX9860ETG+T has a maximum junction temperature of 150°C. To ensure reliable operation, it's recommended to keep the device's junction temperature below 125°C. Engineers should consider thermal management techniques such as heat sinking, thermal vias, and thermal interface materials to dissipate heat effectively.
  • To troubleshoot issues with the MAX9860ETG+T, engineers can use tools such as oscilloscopes, signal generators, and logic analyzers to debug the device's behavior. It's also recommended to consult the datasheet, application notes, and technical support resources provided by Analog Devices. Additionally, engineers can use simulation tools to simulate the device's behavior and identify potential issues.
  • The MAX9860ETG+T has built-in ESD protection, but it's still recommended to follow proper ESD handling and storage procedures to prevent damage. Engineers should use ESD-safe materials, handle the device by the body or pins, and avoid touching the device's pins or exposed internal components.

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MAX9860ETG+T Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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