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MIC2019YM6-TR - Microchip

Description: MICROCHIP - MIC2019YM6-TR - LOAD SWITCH, HS, 5.5V, 0.2 - 2A, 6SOT23

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PCB Footprints
MIC2019YM6-TR - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-Pin SOT-23 (M6)
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3D Models
MIC2019YM6-TR - Microchip  - 3D model - SOT23 (6-Pin) - 6-Pin SOT-23 (M6)
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MIC2019YM6-TR Details

  • Manufacturer Part Number:

    MIC2019YM6-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LSSOP, TSOP6,.11,37

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Additional Feature:

    Adjustable Current Limit

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LOAD SWITCH

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max (Isup):

    0.3 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.6 mm

MIC2019YM6-TR Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane to reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider using a thermal monitoring and shutdown circuit to prevent overheating.
  • The MIC2019YM6-TR has built-in ESD protection diodes on the input pins. However, it is still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended operating conditions, and avoid applying voltage to the output pins before the input pins.
  • The MIC2019YM6-TR is a commercial-grade device, and its reliability and performance may not meet the stringent requirements of high-reliability or aerospace applications. For such applications, consider using a device with a higher reliability rating, such as a QML-V or MIL-PRF-38535 certified device.
  • For soldering, use a temperature profile with a peak temperature of 240°C to 250°C, and a dwell time of 30 seconds to 60 seconds. For rework, use a temperature-controlled soldering iron with a temperature range of 350°C to 400°C, and avoid applying excessive heat or force to the device.

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MIC2019YM6-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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