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MIC7300YMM-TR - Microchip

Description: Operational Amplifiers - Op Amps 2.2V, IttyBitty, Op-Amp with High Drive Capability

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PCB Footprints
MIC7300YMM-TR - Microchip PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - 8-Pin MSOP (MM)
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MIC7300YMM-TR - Microchip  - 3D model - SOT23 (8-Pin) - 8-Pin MSOP (MM)
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MIC7300YMM-TR Details

  • Manufacturer Part Number:

    MIC7300YMM-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    50 dB

  • Common-mode Reject Ratio-Nom:

    70 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.09 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    4 mA

  • Supply Voltage Limit-Max:

    12 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Unity Gain BW-Nom:

    450

  • Voltage Gain-Min:

    15000

  • Wideband:

    NO

  • Width:

    2.97 mm

MIC7300YMM-TR Frequently Asked Questions (FAQs)

  • Microchip recommends a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer to ensure good thermal conductivity. A minimum of 2 oz copper thickness is recommended for the thermal pad.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power dissipation according to the temperature derating curve provided in the datasheet.
  • Microchip recommends using a low-ESR ceramic capacitor with a value between 4.7 μF to 10 μF, and a voltage rating of at least 25 V. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • To troubleshoot output voltage regulation issues, check the input voltage, output load, and feedback resistors for correct values and connections. Verify that the output capacitor is properly sized and placed. Also, ensure that the device is not overheating, and the thermal shutdown is not triggered.
  • The maximum allowed input voltage ripple for the MIC7300YMM-TR is 1 V peak-to-peak. Exceeding this limit may affect the device's performance and stability.

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MIC7300YMM-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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