The recommended land pattern for NTCS0805E3333FHT is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While NTCS0805E3333FHT has a high operating temperature range of -55°C to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at the desired operating temperature.
To prevent electrostatic discharge (ESD) damage, handle NTCS0805E3333FHT with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the component is stored in a dry, ESD-protected environment, and avoid touching the component's pins or body.
The recommended soldering profile for NTCS0805E3333FHT is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes. Ensure that the soldering process is in accordance with the IPC-J-STD-020 standard.
While NTCS0805E3333FHT has a moisture sensitivity level (MSL) of 1, it's still essential to consider the environmental conditions in which the component will operate. If the component will be exposed to high humidity or moisture, ensure that it is properly sealed or coated to prevent moisture ingress.
Trust Checks
This model has been generated by a fully automated process.
Machine Generated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NTCS0805E3333FHT Overview
Use the download button to access the NTCS0805E3333FHT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NTCS0,
or try a keyword search, such as Non-linear Resistors