The recommended land pattern for the NTCS0805E3333GHT is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
The NTCS0805E3333GHT has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources.
The maximum operating temperature range for the NTCS0805E3333GHT is -55°C to 150°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or a shock-absorbing mounting system.
The recommended storage condition for the NTCS0805E3333GHT is in a dry, cool place, away from direct sunlight, with a temperature range of 20°C to 30°C and humidity below 60%.
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NTCS0805E3333GHT Overview
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