SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Seated Height-Max:
1.1 mm
Slew Rate-Nom:
150 V/us
Supply Current-Max:
7.9 mA
Supply Voltage Limit-Max:
20 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Technology:
BIPOLAR
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
45000
Voltage Gain-Min:
501187.2336
Wideband:
NO
Width:
3 mm
OPA828IDGNR Frequently Asked Questions (FAQs)
Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to ensure high-frequency stability and low noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
To ensure stability, use a gain resistor (Rg) that is less than or equal to 1 kΩ, and a feedback capacitor (Cf) that is greater than or equal to 10 pF. Additionally, use a compensation capacitor (Cc) in parallel with Rg to improve stability.
The maximum power dissipation of OPA828IDGNR is 500 mW. However, this can be limited by the thermal resistance of the package and the PCB. Ensure proper thermal design and heat sinking to prevent overheating.
Yes, OPA828IDGNR is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may need to be derated. Consult the datasheet for more information.
Use proper ESD handling and storage procedures to prevent damage. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD arrays, to the input and output pins of the OPA828IDGNR.
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OPA828IDGNR Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
