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XC2C32A-4CP56C - AMD

Description: CPLD - Complex Programmable Logic Devices XC2C32A-4CP56C

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PCB Footprints
XC2C32A-4CP56C - AMD PCB footprint - BGA - BGA - Chip Scale BGA CP56
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XC2C32A-4CP56C - AMD  - 3D model - BGA - Chip Scale BGA CP56
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XC2C32A-4CP56C Details

  • Manufacturer Part Number:

    XC2C32A-4CP56C

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    6 X 6 MM, 0.50 MM PITCH, CSP-56

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    REAL DIGITAL DESIGN TECHNOLOGY

  • Clock Frequency-Max:

    450 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B56

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    33

  • Number of Macro Cells:

    32

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    70 °C

  • Organization:

    33 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA56,10X10,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    240

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    4 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.35 mm

  • Supply Voltage-Max:

    1.9 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

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XC2C32A-4CP56C Overview

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