XC2C32A-6CP56C - AMD

XC2C32A-6CP56C Details

• Manufacturer Part Number:

  XC2C32A-6CP56C

• Part Life Cycle Code:

  Obsolete

• Package Description:

  6 X 6 MM, 0.50 MM PITCH, CSP-56

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.55

• Manufacturer:

  AMD

• YTEOL:

  0

• Additional Feature:

  REAL DIGITAL DESIGN TECHNOLOGY

• Clock Frequency-Max:

  300 MHz

• In-System Programmable:

  YES

• JESD-30 Code:

  S-PBGA-B56

• JESD-609 Code:

  e0

• JTAG BST:

  YES

• Length:

  6 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  33

• Number of Macro Cells:

  32

• Number of Terminals:

  56

• Operating Temperature-Max:

  70 °C

• Organization:

  33 I/O

• Output Function:

  MACROCELL

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LFBGA

• Package Equivalence Code:

  BGA56,10X10,20

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  240

• Programmable Logic Type:

  FLASH PLD

• Propagation Delay:

  6 ns

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.35 mm

• Supply Voltage-Max:

  1.9 V

• Supply Voltage-Min:

  1.7 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  COMMERCIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  6 mm