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XC3S1500-4FG456C - AMD

Description: Xilinx FPGA XC3S1500-4FG456C, Spartan-3 29952 Cells, 1500000 Gates, 212992bit, 29952 Blocks, 456-Pin FBGA

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XC3S1500-4FG456C - AMD PCB footprint - BGA - BGA - XC3S400-4FG456C
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3D Models
XC3S1500-4FG456C - AMD  - 3D model - BGA - XC3S400-4FG456C
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XC3S1500-4FG456C Details

  • Manufacturer Part Number:

    XC3S1500-4FG456C

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    23 X 23 MM, FBGA-456

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    630 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B456

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3328

  • Number of Equivalent Gates:

    1500000

  • Number of Inputs:

    333

  • Number of Logic Cells:

    29952

  • Number of Outputs:

    333

  • Number of Terminals:

    456

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3328 CLBS, 1500000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA456,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC3S1500-4FG456C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S1500-4FG456C is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in Virtex-3 FPGAs, including the XC3S1500. The guide provides guidelines for synchronizing data between clock domains.
  • The power consumption of XC3S1500-4FG456C depends on the device utilization, clock frequency, and operating conditions. Xilinx provides a Power Estimator tool to estimate the power consumption of the device based on the design requirements.
  • Yes, the XC3S1500-4FG456C is suitable for high-reliability applications. Xilinx provides a range of features and tools to support high-reliability design, including built-in error correction, single-event upset (SEU) mitigation, and fault-tolerant design flows.
  • Xilinx provides a range of debugging and testing tools, including ChipScope, SignalTap, and the Vivado Design Suite. These tools allow you to debug and test your design at various stages of development, from RTL simulation to hardware verification.

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XC3S1500-4FG456C Overview

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Image Part Number Model
Part Image XC3S1500-4FG456C AMD Xilinx

Field Programmable Gate Array, 3328 CLBs, 1500000 Gates, 630MHz, 29952-Cell, CMOS, PBGA456

Part Image XC3S1500-4FGG456C AMD Xilinx

Field Programmable Gate Array, 3328 CLBs, 1500000 Gates, 630MHz, 29952-Cell, CMOS, PBGA456

Part Image XC3S1500-4FGG456I AMD Xilinx

Field Programmable Gate Array, 3328 CLBs, 1500000 Gates, 630MHz, 29952-Cell, CMOS, PBGA456

Part Image XC3S1500-4FG456I AMD Xilinx

Field Programmable Gate Array, 3328 CLBs, 1500000 Gates, 630MHz, 29952-Cell, CMOS, PBGA456

Part Image XC3S1500L-4FG456C AMD Xilinx

Field Programmable Gate Array, 3328 CLBs, 1500000 Gates, 29952-Cell, CMOS, PBGA456

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