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XC3S500E-4VQG100I - AMD

Description: FPGA - Field Programmable Gate Array CONNECT EBOM

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XC3S500E-4VQG100I - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQ100
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XC3S500E-4VQG100I - AMD  - 3D model - Quad Flat Packages - VQ100
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XC3S500E-4VQG100I Details

  • Manufacturer Part Number:

    XC3S500E-4VQG100I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    572 MHz

  • Combinatorial Delay of a CLB-Max:

    0.76 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1164

  • Number of Equivalent Gates:

    500000

  • Number of Inputs:

    66

  • Number of Logic Cells:

    10476

  • Number of Outputs:

    59

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1164 CLBS, 500000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XC3S500E-4VQG100I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of XC3S500E-4VQG100I is 350 MHz.
  • You can implement DDR memory interface with XC3S500E-4VQG100I using the Xilinx MIG (Memory Interface Generator) tool, which provides a pre-designed and verified DDR memory interface IP core.
  • Yes, XC3S500E-4VQG100I is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications, and is available in a variety of temperature grades, including commercial, industrial, and extended.
  • XC3S500E-4VQG100I can be programmed using the Xilinx ISE Design Suite, which provides a comprehensive development environment for designing, implementing, and testing FPGA-based systems.
  • The power consumption of XC3S500E-4VQG100I depends on the specific application and operating conditions, but Xilinx provides power estimation tools and documentation to help designers estimate and optimize power consumption.

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XC3S500E-4VQG100I Overview

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Part Image XC3S500E-4VQG100I AMD Xilinx

Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PQFP100

Part Image XC3S500E-4VQG100C AMD

Field Programmable Gate Array, 1164 CLBs, 500000 Gates, 572MHz, 10476-Cell, CMOS, PQFP100