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XC3S50A-4TQG144C - AMD

Description: Spartan®-3A Field Programmable Gate Array (FPGA) IC 108 55296 1584 144-LQFP

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XC3S50A-4TQG144C - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - TQ144/TQG144
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XC3S50A-4TQG144C - AMD  - 3D model - Quad Flat Packages - TQ144/TQG144
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XC3S50A-4TQG144C Details

  • Manufacturer Part Number:

    XC3S50A-4TQG144C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    176

  • Number of Equivalent Gates:

    50000

  • Number of Inputs:

    108

  • Number of Logic Cells:

    1584

  • Number of Outputs:

    101

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    176 CLBS, 50000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC3S50A-4TQG144C Frequently Asked Questions (FAQs)

  • The XC3S50A-4TQG144C has an operating temperature range of -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • To implement a CDC in the XC3S50A-4TQG144C, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum frequency achievable with the XC3S50A-4TQG144C depends on the design complexity and the clocking architecture. However, the FPGA can support clock frequencies up to 350 MHz.
  • To optimize power consumption, use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling. Also, optimize your design for minimal switching activity and use low-power modes when possible.
  • Yes, the XC3S50A-4TQG144C is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its robust design and manufacturing process.

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XC3S50A-4TQG144C Overview

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Part Image XC3S50A-4TQG144C AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PQFP144

Part Image XC3S50AN-4TQ144I AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 280MHz, CMOS, PQFP144

Part Image XC3S50AN-4TQG144CES AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 280MHz, PQFP144

Part Image XC3S50AN-4TQ144C AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 280MHz, CMOS, PQFP144

Part Image XC3S50AN-4TQG144C AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PQFP144

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