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XC4VFX60-10FF1152I - AMD

Description: FPGA - Field Programmable Gate Array BOM fix Disconnect standard BOM change MH to yes

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XC4VFX60-10FF1152I - AMD PCB footprint - BGA - BGA - FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VFX60-10FF1152I - AMD  - 3D model - BGA - FF1152 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VFX60-10FF1152I Details

  • Manufacturer Part Number:

    XC4VFX60-10FF1152I

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    5

  • Clock Frequency-Max:

    1028 MHz

  • Combinatorial Delay of a CLB-Max:

    0.2 ns

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    6320

  • Number of Inputs:

    576

  • Number of Logic Cells:

    56880

  • Number of Outputs:

    576

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    6320 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC4VFX60-10FF1152I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC4VFX60-10FF1152I is 350 MHz, but it can vary depending on the specific design and implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power consumption.
  • The XC4VFX60-10FF1152I has a total of 11,088 Kbits of block RAM, 216 Kbits of distributed RAM, and 128 bits of FIFO RAM.
  • Yes, the XC4VFX60-10FF1152I is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications.
  • Use the Xilinx IP cores for PCIe or SATA, and follow the implementation guidelines provided in the Xilinx documentation and user guides.

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XC4VFX60-10FF1152I Overview

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Image Part Number Model
Part Image XC4VFX60-10FFG1152I AMD

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FF1152C AMD

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FFG1152C AMD Xilinx

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FF1152I AMD Xilinx

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

Part Image XC4VFX60-10FFG1152I AMD Xilinx

Field Programmable Gate Array, 6320 CLBs, 1028MHz, 56880-Cell, CMOS, PBGA1152

For a full list of alternate parts for XC4VFX60-10FF1152I, check out Findchips.com