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XC5VLX30-1FF676C - AMD

Description: FPGA - Field Programmable Gate Array XC5VLX30-1FF676C

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XC5VLX30-1FF676C - AMD PCB footprint - BGA - BGA - FF676
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XC5VLX30-1FF676C - AMD  - 3D model - BGA - FF676
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XC5VLX30-1FF676C Details

  • Manufacturer Part Number:

    XC5VLX30-1FF676C

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6

  • Combinatorial Delay of a CLB-Max:

    0.9 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    2400

  • Number of Inputs:

    400

  • Number of Logic Cells:

    30720

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2400 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC5VLX30-1FF676C Frequently Asked Questions (FAQs)

  • Xilinx provides a PCB design guide and layout recommendations in the 'Virtex-5 FPGA PCB Design and Pin Planning Guide' (UG483) and the 'Virtex-5 FPGA Packaging and Pinout' (UG475) documents. Additionally, Xilinx recommends using their ISE Design Suite and PlanAhead tools to generate optimal pin assignments and routing.
  • Xilinx provides a power distribution network (PDN) design guide in the 'Virtex-5 FPGA Power Management' (UG484) document. It recommends using a multi-layer PCB with a solid ground plane, decoupling capacitors, and a well-designed power distribution network to minimize noise and voltage droop.
  • Xilinx provides thermal management guidelines in the 'Virtex-5 FPGA Thermal Management' (UG485) document. It recommends using a heat sink, thermal interface material, and ensuring good airflow to keep the junction temperature below the recommended maximum of 100°C.
  • Xilinx provides the ISE Design Suite, which includes the ISE Project Navigator, Synthesis, Implementation, and Bitstream Generation tools. You can use these tools to design, implement, and program the FPGA. Additionally, Xilinx offers the Vivado Design Suite, which is a more advanced toolset for designing and implementing FPGA-based systems.
  • Xilinx provides documentation on the usage and limitations of the built-in hard IP blocks in the 'Virtex-5 FPGA Integrated Block for PCI Express' (UG478) and 'Virtex-5 FPGA Memory Interface Solution' (UG479) documents. It's essential to carefully review these documents to ensure correct implementation and to understand any limitations or restrictions.

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XC5VLX30-1FF676C Overview

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