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XC5VSX95T-1FF1136C - AMD

Description: FPGA - XC5VSX95T-1FF1136C

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XC5VSX95T-1FF1136C - AMD PCB footprint - BGA - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package_2023
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XC5VSX95T-1FF1136C - AMD  - 3D model - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package_2023
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XC5VSX95T-1FF1136C Details

  • Manufacturer Part Number:

    XC5VSX95T-1FF1136C

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1136

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6

  • Combinatorial Delay of a CLB-Max:

    0.9 ns

  • JESD-30 Code:

    S-PBGA-B1136

  • JESD-609 Code:

    e0

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    7360

  • Number of Inputs:

    640

  • Number of Logic Cells:

    94208

  • Number of Outputs:

    640

  • Number of Terminals:

    1136

  • Operating Temperature-Max:

    85 °C

  • Organization:

    7360 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1136,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.25 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC5VSX95T-1FF1136C Frequently Asked Questions (FAQs)

  • The XC5VSX95T-1FF1136C has an industrial temperature range of -40°C to 100°C, and a commercial temperature range of 0°C to 85°C.
  • Xilinx recommends using an external POR circuit with a voltage supervisor IC, such as the Xilinx Power Management Controller (PMC) or a third-party device like the Texas Instruments TPS3808. The FPGA's internal POR circuit can also be used, but it may not be as reliable.
  • Xilinx provides detailed PCB layout guidelines in the 'Virtex-5 FPGA PCB Design and Pin Planning Guide' (UG440). Key recommendations include using a solid ground plane, decoupling capacitors, and controlled impedance routing for high-speed signals.
  • To minimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, enable power-saving features like clock gating and dynamic voltage and frequency scaling, and optimize the design for low power using techniques like pipelining and parallel processing.
  • The XC5VSX95T-1FF1136C has 34,600 Kbits of block RAM, which can be used for data storage, FIFOs, and other applications. However, the internal memory has limitations in terms of bandwidth, latency, and availability, so external memory may be required for larger designs.

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XC5VSX95T-1FF1136C Overview

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Part Image XC5VSX95T-1FFG1136I AMD

Field Programmable Gate Array, 7360 CLBs, 94208-Cell, CMOS, PBGA1136

Part Image XC5VSX95T-1FFG1136C AMD

Field Programmable Gate Array, 7360 CLBs, 94208-Cell, CMOS, PBGA1136

Part Image XC5VSX95T-1FFV1136I AMD

Field Programmable Gate Array, 7360 CLBs, 94208-Cell, CMOS, PBGA1136

Part Image XC5VSX95T-1FF1136I AMD Xilinx

Field Programmable Gate Array, 7360 CLBs, 94208-Cell, CMOS, PBGA1136

Part Image XC5VSX95T-1FFV1136I AMD Xilinx

Field Programmable Gate Array, 7360 CLBs, 94208-Cell, CMOS, PBGA1136

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