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XC6SLX25-2FG484I - AMD

Description: FPGA - Field Programmable Gate Array XC6SLX25-2FG484I

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XC6SLX25-2FG484I - AMD PCB footprint - BGA - BGA - FG484
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XC6SLX25-2FG484I - AMD  - 3D model - BGA - FG484
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XC6SLX25-2FG484I Details

  • Manufacturer Part Number:

    XC6SLX25-2FG484I

  • Part Life Cycle Code:

    Active

  • Package Description:

    23 X 23 MM, 1 MM PITCH, FBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.26 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1879

  • Number of Inputs:

    266

  • Number of Logic Cells:

    24051

  • Number of Outputs:

    266

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1879 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XC6SLX25-2FG484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC6SLX25-2FG484I is 350 MHz, but it depends on the specific application and design implementation.
  • The XC6SLX25-2FG484I has a built-in DDR3 memory controller, which can be implemented using the Xilinx Memory Interface Generator (MIG) tool. The MIG tool provides a wizard-based interface to generate the necessary IP cores and constraints for the DDR3 interface.
  • The power consumption of the XC6SLX25-2FG484I depends on the specific application, clock frequency, and operating conditions. However, according to the Xilinx datasheet, the typical power consumption is around 1.2W for a typical design. It's recommended to use the Xilinx Power Estimator (XPE) tool to get a more accurate estimate of power consumption for your specific design.
  • Yes, the XC6SLX25-2FG484I has built-in transceivers that support high-speed serial interfaces like PCIe and SATA. The FPGA has a dedicated PCIe endpoint block and SATA PHY, which can be used to implement these interfaces.
  • Xilinx provides a range of debugging and testing tools, including ChipScope, SignalTap, and the Vivado Logic Analyzer. These tools allow you to debug and test your design at various stages of development, from RTL simulation to hardware implementation.

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XC6SLX25-2FG484I Overview

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Image Part Number Model
Part Image XC6SLX25-2FGG484I AMD Xilinx

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA484

Part Image XC6SLX25-2FGG484C AMD Xilinx

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA484

Part Image XC6SLX25-2FG484C AMD

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA484

Part Image XC6SLX25-2FGG484I AMD

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA484

Part Image XC6SLX25-2FG484I AMD Xilinx

Field Programmable Gate Array, 1879 CLBs, 667MHz, 24051-Cell, CMOS, PBGA484

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