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XC7K410T-2FBG676C - AMD

Description: Kintex-7 FPGA

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XC7K410T-2FBG676C - AMD PCB footprint - BGA - BGA - FBG676
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XC7K410T-2FBG676C - AMD  - 3D model - BGA - FBG676
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XC7K410T-2FBG676C Details

  • Manufacturer Part Number:

    XC7K410T-2FBG676C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    0.25 ns

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    31775

  • Number of Inputs:

    400

  • Number of Logic Cells:

    406720

  • Number of Outputs:

    400

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    85 °C

  • Organization:

    31775 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC7K410T-2FBG676C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7K410T-2FBG676C is 350 MHz, but it depends on the specific design and implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, and optimize clock frequencies, voltage, and design architecture.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface, and follow the Xilinx guidelines for DDR3 implementation.
  • Use the Xilinx ChipScope Pro tool for debugging and troubleshooting, and implement debug cores and logic analyzers in your design.
  • The maximum bandwidth of the PCIe interface on the XC7K410T-2FBG676C is x8 Gen2, which is 4 GB/s per lane, resulting in a total bandwidth of 32 GB/s.

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XC7K410T-2FBG676C Overview

Use the download button to access the XC7K410T-2FBG676C schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XC7K4, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XC7K410T-2FB676C AMD

Field Programmable Gate Array, 31775 CLBs, 1818MHz, 406720-Cell, CMOS, PBGA676

Part Image XC7K410T-2FBG676C AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, 1286MHz, 406720-Cell, CMOS, PBGA676

Part Image XC7K410T-2FBG676I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, 1286MHz, 406720-Cell, CMOS, PBGA676

Part Image XC7K410T-2FB676C AMD Xilinx

Field Programmable Gate Array, 1818MHz, 406720-Cell, CMOS, PBGA676

Part Image XC7K410T-2FBV676I AMD Xilinx

Field Programmable Gate Array, 31775 CLBs, PBGA676

For a full list of alternate parts for XC7K410T-2FBG676C, check out Findchips.com