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XC7S50-2CSGA324C - AMD

Description: XILINX - XC7S50-2CSGA324C - FPGA, Spartan-7, 8150 Blocks, 52160 Macrocells, 2700Kbit RAM, 950mV to 1.05V Core Supply, CSBGA-324

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XC7S50-2CSGA324C - AMD PCB footprint - BGA - BGA - CSG324 Chip-Scale BGA Package Specifications (0.8 mm Pitch)
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XC7S50-2CSGA324C - AMD  - 3D model - BGA - CSG324 Chip-Scale BGA Package Specifications (0.8 mm Pitch)
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XC7S50-2CSGA324C Details

  • Manufacturer Part Number:

    XC7S50-2CSGA324C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-324

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    250

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    250

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA324,18X18,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.5 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

XC7S50-2CSGA324C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7S50 is 500 MHz.
  • You can implement DDR3 memory interface with XC7S50 using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for DDR3 memory interface.
  • The power consumption of XC7S50 depends on the operating frequency, voltage, and other factors. According to the datasheet, the typical power consumption is around 1.5W at 100 MHz and 1.2V.
  • Yes, XC7S50 is suitable for high-reliability applications. It has features like single-event upset (SEU) mitigation, error correction, and built-in self-test (BIST) capabilities.
  • To optimize the design for area and speed with XC7S50, use the Vivado Design Suite, which provides tools like synthesis, mapping, and placement. You can also use techniques like pipelining, parallel processing, and resource sharing.

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XC7S50-2CSGA324C Overview

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