Part Image

XC7S50-2FGGA484I - AMD

Description: Spartan 7 FPGA

Download XC7S50-2FGGA484I Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
XC7S50-2FGGA484I - AMD PCB footprint - BGA - BGA - FGG484_-
click to zoom
3D Models
XC7S50-2FGGA484I - AMD  - 3D model - BGA - FGG484_-
click to zoom

XC7S50-2FGGA484I Details

  • Manufacturer Part Number:

    XC7S50-2FGGA484I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FPBGA-484

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Number of CLBs:

    4075

  • Number of Inputs:

    250

  • Number of Logic Cells:

    52160

  • Number of Outputs:

    250

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4075 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.44 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

XC7S50-2FGGA484I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of XC7S50-2FGGA484I is 450 MHz.
  • You can implement DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx, which generates a customized IP core for the DDR3 interface.
  • The power consumption of XC7S50-2FGGA484I depends on the operating frequency, voltage, and usage. However, the typical power consumption is around 1.2W for a 100 MHz design.
  • Yes, XC7S50-2FGGA484I is suitable for high-reliability applications, as it is designed to meet the requirements of aerospace, defense, and industrial applications.
  • You can secure your design on XC7S50-2FGGA484I using Xilinx's security features, such as bitstream encryption, authentication, and secure boot mechanisms.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

XC7S50-2FGGA484I Overview

Use the download button to access the XC7S50-2FGGA484I schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like XC7S5, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to XC7S50-2FGGA484I

Showing 0 results

XC7S50-2FGGA484I Alternates

Showing results

Image Part Number Model
Part Image XC7S50-2FGGA484I AMD Xilinx

Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA484

Part Image XC7S50-2FGGA484C AMD Xilinx

Field Programmable Gate Array, 4075 CLBs, 1286MHz, 52160-Cell, PBGA484