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XC7S6-2CSGA225I - AMD

Description: IC FPGA 100 I/O 225CSBGA

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PCB Footprints
XC7S6-2CSGA225I - AMD PCB footprint - BGA - BGA - CSGA225
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XC7S6-2CSGA225I Details

  • Manufacturer Part Number:

    XC7S6-2CSGA225I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CSBGA-225

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1286 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PBGA-B225

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Number of CLBs:

    469

  • Number of Inputs:

    100

  • Number of Logic Cells:

    6000

  • Number of Outputs:

    100

  • Number of Terminals:

    225

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    469 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA225,15X15,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

XC7S6-2CSGA225I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC7S6-2CSGA225I is -40°C to 100°C (industrial grade) and -40°C to 125°C (extended industrial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC7S6. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC7S6-2CSGA225I depends on the specific design and usage. However, Xilinx provides power estimation tools and guidelines to help estimate the power consumption. Typically, the static power consumption is around 1-2W, and the dynamic power consumption depends on the clock frequency and activity.
  • Xilinx provides IP cores and reference designs for high-speed interfaces like PCIe and Ethernet. These IP cores are optimized for the specific FPGA family and provide a pre-verified and validated solution. Additionally, Xilinx provides documentation and user guides on how to configure and implement these interfaces.
  • The maximum bandwidth of the internal memory (Block RAM) in XC7S6-2CSGA225I is 12.8 GB/s. This is calculated based on the memory size, clock frequency, and access width.

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XC7S6-2CSGA225I Overview

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Part Image XC7S6-2CSGA225I AMD Xilinx

Field Programmable Gate Array, 469 CLBS, 1286MHz, 6000-Cell, PBGA225

Part Image XC7S6-2CSGA225C AMD Xilinx

Field Programmable Gate Array, 469 CLBS, 1286MHz, 6000-Cell, PBGA225