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XC7VX690T-2FFG1926I - AMD

Description: FPGA - Field Programmable Gate Array XC7VX690T-2FFG1926I

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XC7VX690T-2FFG1926I - AMD PCB footprint - BGA - BGA - ffg1926
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XC7VX690T-2FFG1926I - AMD  - 3D model - BGA - ffg1926
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XC7VX690T-2FFG1926I Details

  • Manufacturer Part Number:

    XC7VX690T-2FFG1926I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1926

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    14

  • Clock Frequency-Max:

    1818 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PBGA-B1926

  • JESD-609 Code:

    e1

  • Length:

    45 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    54150

  • Number of Inputs:

    720

  • Number of Logic Cells:

    693120

  • Number of Outputs:

    720

  • Number of Terminals:

    1926

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    54150 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1924,44X44,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.65 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    45 mm

XC7VX690T-2FFG1926I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC7VX690T-2FFG1926I is 500 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage frequency scaling, and optimize your design for low power using techniques like pipelining and parallel processing.
  • Use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 memory interface IP core, which provides a pre-verified and optimized implementation of the DDR3 interface.
  • Use the Xilinx Vivado Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs, adding decoupling capacitors, and minimizing signal routing lengths.
  • The maximum bandwidth of the PCIe interface on the XC7VX690T-2FFG1926I is 8 GT/s (gigatransfers per second) per lane, with a maximum of 16 lanes, resulting in a total bandwidth of 128 Gbps.

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XC7VX690T-2FFG1926I Overview

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Image Part Number Model
Part Image XC7VX690T-2FFG1926I AMD Xilinx

Field Programmable Gate Array, 54150 CLBs, 1818MHz, 693120-Cell, CMOS, PBGA1926

Part Image XC7VX690T-2FF1926I AMD

Field Programmable Gate Array, 54150 CLBs, 1818MHz, 693120-Cell, CMOS, PBGA1926

Part Image XC7VX690T-2FFG1926C AMD Xilinx

Field Programmable Gate Array, 54150 CLBs, 1818MHz, 693120-Cell, CMOS, PBGA1926

Part Image XC7VX690T-2FFG1926E AMD Xilinx

Field Programmable Gate Array

Part Image XC7VX690T-2FF1926C AMD Xilinx

Field Programmable Gate Array, 1818MHz, 693120-Cell, CMOS, PBGA1924

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