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XC9536XL-10CSG48C - AMD

Description: CPLD - Complex Programmable Logic Devices 3.3V 36-mc CPLD

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PCB Footprints
XC9536XL-10CSG48C - AMD PCB footprint - BGA - BGA - CS48/CSG48
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XC9536XL-10CSG48C - AMD  - 3D model - BGA - CS48/CSG48
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XC9536XL-10CSG48C Details

  • Manufacturer Part Number:

    XC9536XL-10CSG48C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, CSP-48

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    138.88 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B48

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    36

  • Number of Inputs:

    36

  • Number of Macro Cells:

    36

  • Number of Outputs:

    36

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 36 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA48,7X7,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.8 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

XC9536XL-10CSG48C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of XC9536XL-10CSG48C is 160 MHz.
  • To implement a clock domain crossing (CDC) in XC9536XL-10CSG48C, you can use a synchronizer circuit or a FIFO-based CDC. The synchronizer circuit can be implemented using a pair of flip-flops, while the FIFO-based CDC requires a FIFO memory and a clock domain crossing module.
  • The power consumption of XC9536XL-10CSG48C depends on the operating frequency, voltage, and usage. According to the datasheet, the typical power consumption is around 150 mW at 1.8V and 100 MHz. However, this value can vary depending on the specific application and usage.
  • The I/O banks in XC9536XL-10CSG48C can be configured using the I/O bank select pins (BSEL) and the I/O standard select pins (IOSTANDARD). The BSEL pins select the I/O bank, while the IOSTANDARD pins select the I/O standard (e.g., LVCMOS, LVTTL, etc.). The configuration is typically done during device configuration or through the FPGA's programming interface.
  • No, XC9536XL-10CSG48C is not a radiation-hardened device. It is a commercial-grade FPGA and is not designed to withstand radiation or high-reliability applications. For radiation-hardened applications, you should consider using a radiation-hardened FPGA from a vendor like Xilinx or Microsemi.

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XC9536XL-10CSG48C Overview

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Part Image XC9536XL-10CSG48C AMD Xilinx

Flash PLD, 10ns, 36-Cell, CMOS, PBGA48

Part Image XC9536XL-10CS48C AMD Xilinx

Flash PLD, 10ns, 36-Cell, CMOS, PBGA48