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XCAU15P-1SBVB484E - AMD

Description: Artix® UltraScale+ Field Programmable Gate Array (FPGA) IC 204 5347738 170100 484-WFBGA, FCBGA

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PCB Footprints
XCAU15P-1SBVB484E - AMD PCB footprint - BGA - BGA - SBVB484
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XCAU15P-1SBVB484E - AMD  - 3D model - BGA - SBVB484
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XCAU15P-1SBVB484E Details

  • Manufacturer Part Number:

    XCAU15P-1SBVB484E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-484

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    9720

  • Number of Inputs:

    204

  • Number of Logic Cells:

    170100

  • Number of Outputs:

    204

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Organization:

    9720 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    2.79 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

XCAU15P-1SBVB484E Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for XCAU15P-1SBVB484E is 0°C to 100°C (junction temperature) and -40°C to 125°C (storage temperature).
  • To optimize power consumption, use the Power Management features provided by AMD, such as dynamic voltage and frequency scaling, and implement power gating and clock gating in your design. Additionally, optimize your system's power delivery network and use low-power modes when possible.
  • The maximum current rating for XCAU15P-1SBVB484E is 3.5A for the VDD_CORE voltage rail and 1.5A for the VDD_SOC voltage rail. However, the actual current draw will depend on the specific use case and system design.
  • To ensure signal integrity, follow AMD's guidelines for PCB design, routing, and termination. Use controlled impedance traces, add decoupling capacitors, and implement signal shielding and filtering as needed. Additionally, use AMD's signal integrity simulation tools to validate your design.
  • The recommended PCB material is FR4 or equivalent, with a thickness of 0.8mm to 1.6mm. However, the actual PCB material and thickness may vary depending on the specific system design and requirements.

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XCAU15P-1SBVB484E Overview

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Part Image XCAU15P-1SBVB484E AMD Xilinx

Field Programmable Gate Array, 9720 CLBS, 170100-Cell, PBGA484