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XCKU035-1FBVA676I - AMD

Description: XILINX - XCKU035-1FBVA676I - FPGA, KINTEX ULTRASCALE, FCBGA-676

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PCB Footprints
XCKU035-1FBVA676I - AMD PCB footprint - BGA - BGA - FBVA676
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3D Models
XCKU035-1FBVA676I - AMD  - 3D model - BGA - FBVA676
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XCKU035-1FBVA676I Details

  • Manufacturer Part Number:

    XCKU035-1FBVA676I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    1700

  • Number of Inputs:

    520

  • Number of Logic Cells:

    444343

  • Number of Outputs:

    520

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1700 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.71 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XCKU035-1FBVA676I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU035-1FBVA676I is approximately 12W, depending on the operating frequency, voltage, and usage of the device.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The maximum operating frequency of the XCKU035-1FBVA676I is 500 MHz, but this can vary depending on the specific application, clock domain, and device utilization.
  • To ensure signal integrity and reduce noise, use proper PCB design techniques, such as using differential pairs, adding decoupling capacitors, and following Xilinx's guidelines for signal integrity and power integrity.
  • The recommended operating temperature range for the XCKU035-1FBVA676I is -40°C to 100°C, but it can operate up to 125°C with reduced performance and reliability.

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XCKU035-1FBVA676I Overview

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Part Image XCKU035-1FBVA676E AMD

Field Programmable Gate Array, 25391 CLBS, 444343-Cell, PBGA676

Part Image XCKU035-1FBVA676I AMD Xilinx

Field Programmable Gate Array, 1700 CLBs, 444343-Cell, PBGA676

Part Image XCKU035-1FBVA676C AMD Xilinx

Field Programmable Gate Array, 1700 CLBs, 444343-Cell, PBGA676