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XCKU115-2FLVA2104I - AMD

Description: FPGA - Field Programmable Gate Array XCKU115-2FLVA2104I

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XCKU115-2FLVA2104I Details

  • Manufacturer Part Number:

    XCKU115-2FLVA2104I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-2104

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • JESD-609 Code:

    e1

  • Length:

    47.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    5520

  • Number of Inputs:

    832

  • Number of Logic Cells:

    1451100

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    5520 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.11 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    47.5 mm

XCKU115-2FLVA2104I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU115-2FLVA2104I is approximately 25W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the FPGA's built-in power management features, such as dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCKU115-2FLVA2104I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the FPGA's built-in features, such as signal conditioning and deskew, to improve signal quality.
  • The maximum clock frequency supported by the XCKU115-2FLVA2104I is 1.2 GHz, but it can vary depending on the specific design, clock domain, and operating conditions.

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XCKU115-2FLVA2104I Overview

Use the download button to access the XCKU115-2FLVA2104I 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XCKU1, or try a keyword search, such as Field Programmable Gate Arrays

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Part Image XCKU115-2FLVB2104E AMD

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVA2104E AMD

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVB2104E AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVA2104I AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

Part Image XCKU115-2FLVA2104E AMD Xilinx

Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104

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