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XCKU11P-2FFVA1156I - AMD

Description: IC FPGA 464 I/O 1156FCBGA

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PCB Footprints
XCKU11P-2FFVA1156I - AMD PCB footprint - BGA - BGA - FFVC1156
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XCKU11P-2FFVA1156I - AMD  - 3D model - BGA - FFVC1156
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XCKU11P-2FFVA1156I Details

  • Manufacturer Part Number:

    XCKU11P-2FFVA1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1156

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    37320

  • Number of Inputs:

    512

  • Number of Logic Cells:

    653100

  • Number of Outputs:

    512

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    37320 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1156,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.51 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

XCKU11P-2FFVA1156I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU11P-2FFVA1156I is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power optimization IP cores and following the Xilinx Power Management Guide.
  • The maximum operating temperature of the XCKU11P-2FFVA1156I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, follow the Xilinx PCB Design and Signal Integrity Guidelines, use controlled impedance routing, and add termination resistors as needed. Additionally, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity in your design.
  • The maximum clock frequency supported by the XCKU11P-2FFVA1156I is 500 MHz, but it can vary depending on the specific clock domain and the design's complexity. It's recommended to consult the Xilinx Clocking Resources User Guide for more information.

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XCKU11P-2FFVA1156I Overview

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Part Image XCKU11P-2FFVA1156E AMD

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1156

Part Image XCKU11P-2FFVA1156I AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1156

Part Image XCKU11P-2FFVA1156E AMD Xilinx

Field Programmable Gate Array, 37320 CLBS, 653100-Cell, PBGA1156