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XCKU3P-1SFVB784E - AMD

Description: FPGA - Field Programmable Gate Array XCKU3P-1SFVB784E

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XCKU3P-1SFVB784E Details

  • Manufacturer Part Number:

    XCKU3P-1SFVB784E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-784

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    20340

  • Number of Inputs:

    304

  • Number of Logic Cells:

    355950

  • Number of Outputs:

    304

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Organization:

    20340 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA784,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

XCKU3P-1SFVB784E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU3P-1SFVB784E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD-provided power-optimized IP cores and follow the Xilinx UltraScale+ power management guidelines.
  • The XCKU3P-1SFVB784E has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications, including those in harsh environments.
  • Yes, the XCKU3P-1SFVB784E supports high-speed serial interfaces like PCIe Gen3, Ethernet (10GbE, 25GbE, 40GbE, and 100GbE), and others, making it suitable for high-bandwidth applications.
  • To ensure signal integrity and reduce EMI, follow the Xilinx guidelines for PCB design, use controlled impedance routing, and implement proper shielding and grounding techniques. Additionally, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity.

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XCKU3P-1SFVB784E Overview

Use the download button to access the XCKU3P-1SFVB784E 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XCKU3, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XCKU3P-1SFVB784I AMD

Field Programmable Gate Array, 20340 CLBS, 355950-Cell, PBGA784

Part Image XCKU3P-1SFVB784E AMD Xilinx

Field Programmable Gate Array, 20340 CLBS, 355950-Cell, PBGA784