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XCKU5P-2FFVA676E - AMD

Description: FPGA - Field Programmable Gate Array XCKU5P-2FFVA676E

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XCKU5P-2FFVA676E - AMD PCB footprint - BGA - BGA - FFVA676
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XCKU5P-2FFVA676E - AMD  - 3D model - BGA - FFVA676
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XCKU5P-2FFVA676E Details

  • Manufacturer Part Number:

    XCKU5P-2FFVA676E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-676

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B676

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    27120

  • Number of Inputs:

    304

  • Number of Logic Cells:

    474600

  • Number of Outputs:

    304

  • Number of Terminals:

    676

  • Operating Temperature-Max:

    100 °C

  • Organization:

    27120 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA676,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    250

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.52 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XCKU5P-2FFVA676E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCKU5P-2FFVA676E is approximately 12W, but it can vary depending on the design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, optimize your design for area and reduce unnecessary logic.
  • The maximum operating temperature of the XCKU5P-2FFVA676E is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range for optimal performance and reliability.
  • No, the XCKU5P-2FFVA676E is not a radiation-hardened device. If you need a radiation-hardened FPGA, consider Xilinx's QV or QPro devices, which are designed for space and high-reliability applications.
  • To ensure signal integrity, follow Xilinx's guidelines for PCB design, use controlled impedance traces, and add termination resistors as needed. Additionally, use the Xilinx Vivado Design Suite to analyze and optimize your design for signal integrity.

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XCKU5P-2FFVA676E Overview

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Image Part Number Model
Part Image XCKU5P-2FFVA676I AMD

Field Programmable Gate Array, 27120 CLBS, 474600-Cell, PBGA676

Part Image XCKU5P-2FFVA676E AMD Xilinx

Field Programmable Gate Array, 27120 CLBS, 474600-Cell, PBGA676