XCKU5P-L1SFVB784I - AMD

XCKU5P-L1SFVB784I Details

• Manufacturer Part Number:

  XCKU5P-L1SFVB784I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  BGA-784

• Country Of Origin:

  Taiwan

• HTS Code:

  8542.31.00.60

• Factory Lead Time:

  16 Weeks

• Manufacturer:

  AMD

• YTEOL:

  10

• Additional Feature:

  IT ALSO OPERATES AT 0.85 V

• JESD-30 Code:

  S-PBGA-B784

• JESD-609 Code:

  e1

• Length:

  23 mm

• Moisture Sensitivity Level:

  4

• Number of CLBs:

  27120

• Number of Inputs:

  304

• Number of Logic Cells:

  474600

• Number of Outputs:

  304

• Number of Terminals:

  784

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  27120 CLBS

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Equivalence Code:

  BGA784,28X28,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  250

• Programmable Logic Type:

  FIELD PROGRAMMABLE GATE ARRAY

• Seated Height-Max:

  3.32 mm

• Supply Voltage-Max:

  0.742 V

• Supply Voltage-Min:

  0.698 V

• Supply Voltage-Nom:

  0.72 V

• Surface Mount:

  YES

• Technology:

  16 nm

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  23 mm