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XCVU13P-1FLGA2577E - AMD

Description: IC FPGA 448 I/O 2577FCBGA

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XCVU13P-1FLGA2577E - AMD - PCB symbol
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PCB Footprints
XCVU13P-1FLGA2577E - AMD PCB footprint - BGA - BGA - FLGA2577
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XCVU13P-1FLGA2577E - AMD - 3D model - BGA - FLGA2577
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XCVU13P-1FLGA2577E Details

  • Manufacturer Part Number:

    XCVU13P-1FLGA2577E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2577

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2577

  • Length:

    52.5 mm

  • Number of CLBs:

    216000

  • Number of Inputs:

    832

  • Number of Logic Cells:

    3780000

  • Number of Outputs:

    832

  • Number of Terminals:

    2577

  • Operating Temperature-Max:

    100 °C

  • Organization:

    216000 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2577,51X51,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.24 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    52.5 mm

XCVU13P-1FLGA2577E Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU13P-1FLGA2577E is approximately 25W, but this can vary depending on the specific application, clock frequency, and usage of resources.
  • To optimize power consumption, use the Vivado Power Analysis tool to identify power-hungry components and optimize clock frequencies, voltage, and resource utilization. Additionally, consider using power-saving features like clock gating and dynamic voltage and frequency scaling.
  • The maximum operating temperature of the XCVU13P-1FLGA2577E is 100°C (industrial grade) or 125°C (extended temperature range). Ensure proper cooling and thermal management to maintain reliable operation within the specified temperature range.
  • To ensure signal integrity, follow best practices for PCB design, such as using controlled impedance traces, minimizing signal routing, and using signal termination. Additionally, use the Vivado Design Suite to analyze and optimize signal integrity for your specific design.
  • The recommended PCB stackup for the XCVU13P-1FLGA2577E is a 4-layer or 6-layer stackup with a minimum of 1 oz copper thickness. Ensure proper signal return paths, decoupling, and power plane design to minimize noise and signal degradation.

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XCVU13P-1FLGA2577E Overview

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XCVU13P-1FLGA2577E Alternates

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Part Image XCVU13P-1FLGA2577E AMD Xilinx

Field Programmable Gate Array, 216000 CLBS, 3780000-Cell, PBGA2577
Part Image XCVU13P-1FLGA2577I AMD Xilinx

Field Programmable Gate Array, 216000 CLBS, 3780000-Cell, PBGA2577