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XCVU190-2FLGC2104E - AMD

Description: IC FPGA 416 I/O 2104FCBGA

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XCVU190-2FLGC2104E - AMD PCB footprint - BGA - BGA - XCVU190-2FLGC2104E
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XCVU190-2FLGC2104E - AMD  - 3D model - BGA - XCVU190-2FLGC2104E
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XCVU190-2FLGC2104E Details

  • Manufacturer Part Number:

    XCVU190-2FLGC2104E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2104

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • JESD-609 Code:

    e1

  • Length:

    47.5 mm

  • Number of CLBs:

    1800

  • Number of Inputs:

    702

  • Number of Logic Cells:

    2349900

  • Number of Outputs:

    702

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Organization:

    1800 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.32 mm

  • Supply Voltage-Max:

    0.979 V

  • Supply Voltage-Min:

    0.922 V

  • Supply Voltage-Nom:

    0.95 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    47.5 mm

XCVU190-2FLGC2104E Frequently Asked Questions (FAQs)

  • AMD provides a PCB design guide and layout recommendations in the XCVU190 FPGA PCB Design Guide (UG575) and the 7 Series FPGAs PCB Design and Pin Planning Guide (UG583). Additionally, AMD recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes.
  • AMD provides power estimation and thermal management guidelines in the XCVU190 FPGA Power Management Guide (UG576) and the 7 Series FPGAs Power Management Guide (UG584). Engineers can use the Xilinx Power Estimator (XPE) tool to estimate power consumption and optimize their design accordingly.
  • AMD recommends using a single, high-quality clock source and distributing it to the FPGA using a clock tree. For reset strategies, AMD suggests using a single, asynchronous reset signal and ensuring that all clock domains are properly reset. More information can be found in the XCVU190 FPGA Clocking and Reset Guide (UG577).
  • AMD provides signal integrity and EMI reduction guidelines in the XCVU190 FPGA Signal Integrity Guide (UG578) and the 7 Series FPGAs Signal Integrity Guide (UG585). Engineers can use tools like the Xilinx Signal Integrity Wizard to analyze and optimize their design for signal integrity and EMI reduction.
  • AMD recommends using the Vivado Design Suite, which provides a comprehensive design flow for FPGA development, including design entry, synthesis, implementation, and verification. Engineers can also use the Vivado IP Integrator to integrate IP blocks and the Vivado Debug and Serial I/O Toolkit for debugging and serial I/O management.

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XCVU190-2FLGC2104E Overview

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Part Image XCVU190-2FLGC2104I AMD

Field Programmable Gate Array, 1800 CLBs, 2349900-Cell, PBGA2104

Part Image XCVU190-2FLGC2104C AMD

Field Programmable Gate Array

Part Image XCVU190-2FLGC2104E AMD Xilinx

Field Programmable Gate Array, 1800 CLBs, 2349900-Cell, PBGA2104