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XCVU9P-2FLGA2104I - AMD

Description: Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 416 391168000 2586150 2104-BBGA, FCBGA

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XCVU9P-2FLGA2104I - AMD PCB footprint - BGA - BGA - FLGA2104 (XCVU9P) Flip-Chip, Fine-Pitch BGA
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XCVU9P-2FLGA2104I - AMD  - 3D model - BGA - FLGA2104 (XCVU9P) Flip-Chip, Fine-Pitch BGA
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XCVU9P-2FLGA2104I Details

  • Manufacturer Part Number:

    XCVU9P-2FLGA2104I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-2104

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B2104

  • Length:

    47.5 mm

  • Number of CLBs:

    147780

  • Number of Inputs:

    832

  • Number of Logic Cells:

    2586150

  • Number of Outputs:

    832

  • Number of Terminals:

    2104

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    147780 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA2104,46X46,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    4.24 mm

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    16 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    47.5 mm

XCVU9P-2FLGA2104I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCVU9P-2FLGA2104I is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD Power Estimator (APE) tool to estimate power consumption early in the design cycle.
  • The maximum operating temperature of the XCVU9P-2FLGA2104I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, use differential signaling where possible, and follow AMD's guidelines for PCB design and layout. Additionally, consider using the AMD Signal Integrity Wizard to analyze and optimize signal integrity.
  • The maximum clock frequency supported by the XCVU9P-2FLGA2104I is 1.2 GHz, but it can vary depending on the specific design, clock domain, and operating conditions.

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XCVU9P-2FLGA2104I Overview

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Part Image XCVU9P-2FLGA2104E AMD

Field Programmable Gate Array, 147780 CLBS, 2586150-Cell, PBGA2104

Part Image XCVU9P-2FLGA2104I AMD Xilinx

Field Programmable Gate Array, 147780 CLBS, 2586150-Cell, PBGA2104