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66AK2G12ABYA100E - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC Multicore DSP+Arm, 1 Arm A15 cores, 1x C66x DSP core 625-FCBGA -40 to 105

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66AK2G12ABYA100E - Texas Instruments - PCB symbol
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PCB Footprints
66AK2G12ABYA100E - Texas Instruments PCB footprint - BGA - BGA - ABY0625A_2021_1-1
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66AK2G12ABYA100E - Texas Instruments - 3D model - BGA - ABY0625A_2021_1-1
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66AK2G12ABYA100E Details

  • Manufacturer Part Number:

    66AK2G12ABYA100E

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B625

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    625

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA625,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2G12ABYA100E Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the '66AK2G12 and 66AK2H12 KeyStone II Multicore DSPs Silicon Errata' document. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • To optimize power consumption, use the Power Management Module (PMM) to control the voltage and frequency of the cores. Additionally, use the Dynamic Voltage and Frequency Scaling (DVFS) feature to adjust the voltage and frequency based on the system's workload. Refer to the '66AK2G12 and 66AK2H12 Power Management Module (PMM) User's Guide' for more information.
  • The maximum operating temperature range for the 66AK2G12ABYA100E is -40°C to 100°C (industrial temperature range). However, it's recommended to operate the device within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure EMC, follow the guidelines provided in the '66AK2G12 and 66AK2H12 Electromagnetic Compatibility (EMC) and Radio-Frequency Interference (RFI) Design Guide'. This document provides recommendations for PCB layout, shielding, and filtering to minimize electromagnetic interference.
  • The recommended clocking scheme for the 66AK2G12ABYA100E is to use a single clock source for all cores and peripherals. This ensures synchronization and minimizes clock domain crossing issues. Refer to the '66AK2G12 and 66AK2H12 Clocking and Reset User's Guide' for more information.

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66AK2G12ABYA100E Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image 66AK2G12ABYA100 Texas Instruments

SoC, CMOS, PBGA625