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66AK2G12ABYA60 - Texas Instruments

Description: Digital Signal Processors & Controllers - DSP, DSC High performance multicore DSP+Arm - 1x Arm A15 cores, 1x C66x DSP core 625-FCBGA -40 to 105

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66AK2G12ABYA60 - Texas Instruments - PCB symbol
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PCB Footprints
66AK2G12ABYA60 - Texas Instruments PCB footprint - BGA - BGA - ABY0625A_2021
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66AK2G12ABYA60 - Texas Instruments - 3D model - BGA - ABY0625A_2021
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66AK2G12ABYA60 Details

  • Manufacturer Part Number:

    66AK2G12ABYA60

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.75

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • JESD-30 Code:

    S-PBGA-B625

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    625

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA625,25X25,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.56 mm

  • Supply Voltage-Max:

    0.945 V

  • Supply Voltage-Min:

    0.855 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2G12ABYA60 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout and thermal management guide in the '66AK2G12 and 66AK2H12 KeyStone II Multicore DSPs Silicon Revision 1.x, 2.x, 3.x, and 4.x PCB and Thermal Design Guide' document. It's essential to follow these guidelines to ensure optimal performance and thermal dissipation.
  • The DDR3 memory interface on the 66AK2G12ABYA60 can be configured using the DDR3 PHY register settings. Refer to the '66AK2G12 and 66AK2H12 DDR3 PHY Register Description' document for detailed information on register settings and configuration. Additionally, Texas Instruments provides a DDR3 PHY configuration tool to simplify the process.
  • The maximum operating frequency of the 66AK2G12ABYA60 is 1.2 GHz. To achieve this frequency, ensure that the device is properly cooled, and the power supply voltage is set to the recommended 1.0V. Additionally, optimize the clock tree and PLL settings to minimize clock jitter and ensure stable operation at the maximum frequency.
  • The 66AK2G12ABYA60 has a built-in power management module that allows for dynamic voltage and frequency scaling. Use the Power Management IC (PMIC) to control the power rails and implement power-saving modes. Refer to the '66AK2G12 and 66AK2H12 Power Management' document for detailed information on power management implementation.
  • The 66AK2G12ABYA60 has a flexible boot process that can be configured using the Boot Mode Pins and the Boot ROM. Refer to the '66AK2G12 and 66AK2H12 Boot Process' document for detailed information on the boot process and configuration options. Additionally, use the TI's Bootloader software to simplify the boot process configuration.

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66AK2G12ABYA60 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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