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66AK2H12AAAW2 - Texas Instruments

Description: IC DSP ARM SOC 1517BGA

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PCB Footprints
66AK2H12AAAW2 - Texas Instruments PCB footprint - BGA - BGA - AAW (S-PBGA-N1517)
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3D Models
66AK2H12AAAW2 - Texas Instruments  - 3D model - BGA - AAW (S-PBGA-N1517)
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66AK2H12AAAW2 Details

  • Manufacturer Part Number:

    66AK2H12AAAW2

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    PLASTIC, FCBGA-1517

  • Pin Count:

    1517

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    24

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    156.25 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.75 mm

  • Speed:

    1200 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H12AAAW2 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in their application notes, which includes guidelines for signal routing, power distribution, and thermal management to ensure optimal performance and minimize noise.
  • To optimize power consumption, use the device's power-saving features such as dynamic voltage and frequency scaling, and implement power gating for unused modules. Additionally, optimize the system's clock frequency and voltage to minimize power consumption.
  • The 66AK2H12AAAW2 has a high thermal design power (TDP) and requires proper thermal management to prevent overheating. Use a heat sink or thermal interface material, and ensure good airflow around the device to maintain a safe operating temperature.
  • To ensure EMC, follow proper PCB design and layout guidelines, use shielding and filtering techniques, and implement electromagnetic interference (EMI) mitigation strategies such as spread spectrum clocking and EMI filters.
  • When using the 66AK2H12AAAW2 in a harsh environment, consider the operating temperature range, humidity, and vibration. Implement proper thermal management, use conformal coating or potting, and ensure the device is properly secured to the PCB to prevent mechanical stress.

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66AK2H12AAAW2 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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