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66AK2H12BAAWA2 - Texas Instruments

Description: Multicore DSP+ARM KeyStone II System-on-Chip (SoC)

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66AK2H12BAAWA2 - Texas Instruments - PCB symbol
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PCB Footprints
66AK2H12BAAWA2 - Texas Instruments PCB footprint - BGA - BGA - AAW1517B
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3D Models
66AK2H12BAAWA2 - Texas Instruments - 3D model - BGA - AAW1517B
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66AK2H12BAAWA2 Details

  • Manufacturer Part Number:

    66AK2H12BAAWA2

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FCBGA-1517

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    16

  • Boundary Scan:

    YES

  • External Data Bus Width:

    64

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.75 mm

  • Speed:

    1200 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H12BAAWA2 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane and thermal vias to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the power planes.
  • Use controlled impedance traces, add series termination resistors, and consider using differential signaling. Also, ensure that the PCB material has a low dielectric loss tangent to minimize signal attenuation.
  • Power up the device in the following sequence: VDDA, VDD, VDDS, and finally, the clock signal. This ensures that the internal voltage regulators are powered up correctly.
  • Use the power management features, such as dynamic voltage and frequency scaling, and clock gating. Also, consider using a low-power mode or shutdown mode when the device is not in use.
  • Use the JTAG interface for firmware updates. Ensure that the update process is done in a controlled environment to prevent data corruption or device malfunction.

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66AK2H12BAAWA2 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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