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66AK2H14AAAW24 - Texas Instruments

Description: IC DSP ARM SOC 1517BGA

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PCB Footprints
66AK2H14AAAW24 - Texas Instruments PCB footprint - BGA - BGA - AAW (S-PBGA-N1517)-1
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3D Models
66AK2H14AAAW24 - Texas Instruments  - 3D model - BGA - AAW (S-PBGA-N1517)-1
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66AK2H14AAAW24 Details

  • Manufacturer Part Number:

    66AK2H14AAAW24

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    PLASTIC, FCBGA-1517

  • Pin Count:

    1517

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 1200 GHZ

  • Address Bus Width:

    24

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    156.25 MHz

  • External Data Bus Width:

    16

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B1517

  • JESD-609 Code:

    e1

  • Length:

    40 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1517

  • Operating Temperature-Max:

    85 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    3.75 mm

  • Speed:

    1400 MHz

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    40 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

66AK2H14AAAW24 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide for the 66AK2H14AAAW24, which includes guidelines for signal routing, power distribution, and thermal management. It's essential to follow this guide to ensure optimal performance and minimize signal integrity issues.
  • To optimize power consumption, it's recommended to use the device's power-saving features, such as dynamic voltage and frequency scaling, and to optimize the system's clock frequency and voltage settings. Additionally, using a low-power mode or shutdown mode when the device is not in use can help reduce power consumption.
  • The 66AK2H14AAAW24 has a high thermal design power (TDP) of 25W, so it's essential to implement proper thermal management to prevent overheating. This includes using a heat sink, thermal interface material, and ensuring good airflow around the device.
  • To ensure signal integrity and minimize EMI, it's recommended to follow proper PCB design practices, such as using differential signaling, minimizing signal trace lengths, and using shielding and filtering techniques. Additionally, using a signal integrity analysis tool can help identify and mitigate potential signal integrity issues.
  • When using the 66AK2H14AAAW24 in a harsh environment, it's essential to consider the device's operating temperature range, humidity, and vibration tolerance. Additionally, using conformal coating, potting, or other environmental protection methods can help ensure the device's reliability in harsh environments.

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66AK2H14AAAW24 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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