Description:The 72V293 128K x 9/64K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.
IT CAN ALSO BE CONFIGURED AS 128K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Alternate Memory Width:
9
Clock Frequency-Max (fCLK):
166 MHz
Cycle Time:
6 ns
JESD-30 Code:
S-PBGA-B100
JESD-609 Code:
e0
Length:
11 mm
Memory Density:
1179648 bit
Memory IC Type:
OTHER FIFO
Memory Width:
18
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
100
Number of Words:
65536 words
Number of Words Code:
64000
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
70 °C
Organization:
64KX18
Output Enable:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LBGA
Package Equivalence Code:
BGA100,10X10,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE
Parallel/Serial:
PARALLEL
Peak Reflow Temperature (Cel):
225
Qualification Status:
Not Qualified
Seated Height-Max:
1.5 mm
Standby Current-Max:
0.015 A
Supply Current-Max:
0.035 mA
Supply Voltage-Max (Vsup):
3.45 V
Supply Voltage-Min (Vsup):
3.15 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Tin/Lead (Sn63Pb37)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
11 mm
72V293L6BC Frequently Asked Questions (FAQs)
Renesas provides a recommended PCB layout in their application note (AN1844) for the 72V293L6BC, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
To ensure reliable operation in high-temperature environments, it's essential to follow Renesas' guidelines for thermal design, including using a heat sink, thermal interface material, and ensuring good airflow. Additionally, consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection mechanisms.
Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for the input and output capacitors. The specific capacitor values and types may vary depending on the application and operating conditions. It's essential to consult the datasheet and application notes for more information.
To troubleshoot issues with the 72V293L6BC, start by reviewing the application circuit and PCB layout to ensure they meet Renesas' guidelines. Check for proper thermal design, input and output capacitor selection, and correct component placement. Use oscilloscopes and thermal imaging tools to monitor the device's behavior and identify potential issues. Consult Renesas' application notes and technical support resources for further guidance.
Yes, the 72V293L6BC is a high-frequency switching regulator, and as such, it can generate electromagnetic interference (EMI). To minimize EMI, follow Renesas' guidelines for PCB layout, component selection, and shielding. Use EMI filters, such as common-mode chokes and capacitors, to reduce emissions. Ensure that the device is properly decoupled and that the input and output lines are properly terminated.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
72V293L6BC Overview
Use the download button to access the 72V293L6BC schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like 72V29,
or try a keyword search, such as FIFOs
