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72V3690L6PFG - Renesas Electronics

Description: The 72V3690 32K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO's are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes.

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72V3690L6PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - pkg128
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72V3690L6PFG Details

  • Manufacturer Part Number:

    72V3690L6PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PKG128

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    4 ns

  • Additional Feature:

    RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Cycle Time:

    6 ns

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    1179648 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    128

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    32KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

72V3690L6PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN3804EU0100) which includes thermal design considerations, such as thermal vias, copper pours, and component placement, to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and setting the overcurrent threshold.
  • Renesas recommends using a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF, placed as close as possible to the VIN pin, to filter out high-frequency noise and ensure stable operation.
  • Renesas provides EMC design guidelines in their application note (R01AN3804EU0100), which include recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure compliance with relevant EMC standards.
  • The 72V3690L6PFG is rated for operation from -40°C to +125°C (TJ), but the maximum operating temperature range may vary depending on the specific application and thermal design. It's essential to consult the datasheet and application notes for specific guidance on thermal management.

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72V3690L6PFG Overview

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