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72V81L15PAG - Renesas Electronics

Description: The 72V81 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V81L15PAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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72V81L15PAG - Renesas Electronics  - 3D model - Small Outline Packages - PAG56-ren1
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72V81L15PAG Details

  • Manufacturer Part Number:

    72V81L15PAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    4608 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    512X9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

72V81L15PAG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance and ensure reliable operation.
  • Renesas recommends following the guidelines in their reliability handbook, which includes derating curves, thermal management strategies, and component selection considerations to ensure reliable operation in high-temperature environments.
  • Renesas recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output, and suggests using X5R or X7R dielectric capacitors for optimal performance and reliability.
  • Renesas provides a troubleshooting guide in their application note documents, which includes steps to identify and resolve common issues, such as checking for proper power sequencing, ensuring correct component values, and verifying PCB layout and thermal design.
  • Renesas provides package-specific information in their datasheet and application notes, including differences in thermal performance, pinout, and electrical characteristics. Engineers should carefully review these documents to ensure the selected package meets their design requirements.

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72V81L15PAG Overview

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