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72V82L15PAG - Renesas Electronics

Description: The 72V82 is a dual-FIFO memory that loads and empties data on a first-in/first-out basis. It utilizes a 9-bit wide data array to allow for control and parity bits at the user's option. This is useful in data communications applications where a parity bit is needed for transmission/reception error checking. It is designed for those applications requiring asynchronous and simultaneous read/writes in multiprocessing and rate buffer applications.

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72V82L15PAG - Renesas Electronics - PCB symbol
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72V82L15PAG - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PAG56-ren1
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72V82L15PAG - Renesas Electronics - 3D model - Small Outline Packages - PAG56-ren1
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72V82L15PAG Details

  • Manufacturer Part Number:

    72V82L15PAG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Pin Count:

    56

  • Manufacturer Package Code:

    PAG56

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    9216 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP56,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

72V82L15PAG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a shielded enclosure, keep sensitive analog circuits away from the switching node, and implement a common-mode choke or ferrite bead to reduce EMI. Ensure proper PCB layout and decoupling to minimize radiation.
  • Use the device's built-in power-saving features, such as dynamic voltage and frequency scaling. Optimize the system's clock frequency, voltage, and current consumption to minimize power loss.
  • Use a 4-wire Kelvin connection for accurate voltage and current measurements. Ensure proper probe placement and signal integrity to minimize measurement errors.

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72V82L15PAG Overview

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72V82L15PAG Alternates

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Part Image 7282L15PAG Integrated Device Technology Inc

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Part Image IDT7282L15PA8 Integrated Device Technology Inc

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Part Image IDT7282L15PAI8 Integrated Device Technology Inc

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Part Image IDT7282L15PAG8 Renesas Electronics Corporation

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