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ADC12DL3200ACF - Texas Instruments

Description: 12-Bit, Dual 3.2-GSPS or Single 6.4-GSPS, RF-Sampling Analog-to-Digital Converter (LVDS Interface)

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ADC12DL3200ACF - Texas Instruments PCB footprint - BGA - BGA - ACF0256A_2021
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ADC12DL3200ACF - Texas Instruments  - 3D model - BGA - ACF0256A_2021
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ADC12DL3200ACF Details

  • Manufacturer Part Number:

    ADC12DL3200ACF

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-256

  • ECCN Code:

    3A001.A.5.A.3

  • HTS Code:

    8542.39.00.30

  • Date Of Intro:

    2018-05-20

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    Peak-to-peak input voltage range(V) : 0.8

  • Analog Input Voltage-Max:

    1.04 V

  • Analog Input Voltage-Min:

    -1.04 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL, PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,39

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    3200 MHz

  • Seated Height-Max:

    3.31 mm

  • Supply Current-Max:

    1300 mA

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    17 mm

ADC12DL3200ACF Frequently Asked Questions (FAQs)

  • The optimal clock frequency for the ADC12DL3200ACF is between 100 MHz to 1.2 GHz, depending on the specific application and desired performance. However, it's recommended to use a clock frequency that is a multiple of the sampling frequency to minimize jitter and ensure optimal performance.
  • To optimize the analog input signal chain for the ADC12DL3200ACF, ensure that the input signal is properly filtered and amplified to match the ADC's input range. Use a low-pass filter to remove high-frequency noise and a buffer amplifier to drive the ADC's input. Additionally, ensure that the input signal is properly terminated and matched to the ADC's input impedance.
  • For optimal performance, it's recommended to follow a star-grounding layout and routing approach for the ADC12DL3200ACF. Keep the analog and digital grounds separate, and use a solid ground plane to minimize noise and crosstalk. Route the clock and data lines away from the analog input signals, and use shielding and filtering to minimize electromagnetic interference (EMI).
  • Metastability issues in the ADC12DL3200ACF can be handled by using a metastable-resistant design approach. This includes using synchronizers, such as flip-flops or FIFOs, to resynchronize the data and clock signals. Additionally, use a clock domain crossing (CDC) circuit to ensure that the clock and data signals are properly synchronized across clock domains.
  • For optimal performance, it's recommended to use a multi-layer decoupling approach for the ADC12DL3200ACF's power supply. Use a combination of ceramic capacitors, tantalum capacitors, and electrolytic capacitors to filter out noise and ripple on the power supply lines. Ensure that the decoupling capacitors are placed close to the ADC's power pins and are properly connected to the ground plane.

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ADC12DL3200ACF Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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