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ADC16DX370RME25 - Texas Instruments

Description: Analog to Digital Converters - ADC Dual 16bit 370 MSPS ADC

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PCB Footprints
ADC16DX370RME25 - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RME0056A
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3D Models
ADC16DX370RME25 - Texas Instruments  - 3D model - Quad Flat No-Lead - RME0056A
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ADC16DX370RME25 Details

  • Manufacturer Part Number:

    ADC16DX370RME25

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    GREEN, WQFN-56

  • Pin Count:

    56

  • ECCN Code:

    3A991.c.4

  • HTS Code:

    8542.39.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Analog Input Voltage-Max:

    1.7 V

  • Analog Input Voltage-Min:

    -1.7 V

  • Conversion Time-Max:

    0.0027 µs

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Linearity Error-Max (EL):

    0.00686646%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    2

  • Number of Bits:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.31SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    370 MHz

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

ADC16DX370RME25 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout guide in the datasheet, but it's essential to follow good PCB design practices, such as separating analog and digital grounds, using a solid ground plane, and minimizing signal trace lengths. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog power plane and a dedicated digital power plane.
  • To optimize the ADC's performance, it's essential to understand the specific requirements of your application. Consider factors such as signal frequency, amplitude, and noise levels. Adjust the ADC's settings, such as the sampling rate, gain, and offset, to match your application's requirements. Additionally, consider using the ADC's built-in features, such as the programmable gain amplifier and the digital filter, to improve performance.
  • The ADC16DX370RME25 has a parallel interface, which can be connected to a microcontroller or FPGA using a parallel bus. Ensure that the interface signals are properly terminated, and consider using a buffer or a level shifter if necessary. Additionally, consider using a SPI or I2C interface if available on the microcontroller or FPGA to simplify the interface.
  • The ADC16DX370RME25 has a latency of approximately 10 clock cycles. To ensure accurate timestamping, consider using a timestamping module or a separate clock domain for the ADC. Additionally, consider using a FIFO or a buffer to store the ADC data and timestamp it using a separate clock signal.
  • The ADC16DX370RME25 has a specified operating temperature range of -40°C to 125°C. Ensure that the device is properly heat-sinked, and consider using thermal vias or a heat sink to dissipate heat. Additionally, consider using a temperature sensor to monitor the device's temperature and adjust the operating conditions accordingly.

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ADC16DX370RME25 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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